Korean chip manufacturer SK Hynix said today that it has completed the internal certification process for the next generation of high-frequency wide memory 4 (HBM4) chips and has established a production system for customers. Reuters reported that i...
Korean chip manufacturer SK Hynix said today that it has completed the internal certification process for the next generation of high-frequency wide memory 4 (HBM4) chips and has established a production system for customers.
Reuters reported that in March this year, the major supplier of the artificial intelligence (AI) Longtou NVIDIA (Nvidia) said that it had delivered HBM4 12-layer chip samples to customers and expected to complete the production preparation of 12-layer HBM4 products in the second half of this year.
HBM is a dynamic random access memory (DRAM) standard that was first put into production in 2013, using vertical stacking of wafers to save space and reduce energy consumption, which helps to process a large amount of data generated by complex AI applications.
Stimulated by the market's optimistic view of HBM4 chip production plans, SK Hynix's stock price once rose by 7.3%, setting a new high, surpassing the KOSPI's 1.2%.
Meritz Securities analyst Kim Sunwoo estimated that SK Hynix's market share in the HBM market will remain at 60% in 2026, benefiting from being the first to supply HBM4 and snatching machines to major customers.
Currently, SK Hynix is NVIDIA's main HBM supplier, but Samsung Electronics and Micron also have small supply.
