The demand for generative AI and high-performance computing (HPC) has increased rapidly, and a new wave of upgrade trends have emerged in the memory field. The international standard mechanism JEDEC (Solid-State Technology Association) has completed...
The demand for generative AI and high-performance computing (HPC) has increased rapidly, and a new wave of upgrade trends have emerged in the memory field. The international standard mechanism JEDEC (Solid-State Technology Association) has completed the DDR6 standard formulation in 2024, and is expected to complete the verification in 2026, and will introduce the first wave of server and AI platforms in 2027 to serve as the mainstream next-generation memory architecture to replace DDR5.
According to the standards released by JEDEC, the initial transmission rate of DDR6 reaches 8800 MT/s, up to 17,600 MT/s, an increase of 83% compared to the 4800 MT/s of DDR5. The new standard adopts the 4-bit channel design, replacing the 2#215;32-bit structure of DDR5, which not only effectively reduces power consumption and delays, but also further enhances the high frequency width and high distribution performance in AI and HPC scenarios.
DDR6 will be introduced into the new module interface CAMM2 (Compression Attached Memory Module), in response to the stability and information quality required for high-speed operation, replacing the traditional vertical plug-in DIMM. CAMM2 adopts a lateral pressure-combined design, with larger contact area and signal integrity, which helps improve space utilization and heat dissipation efficiency, and is expected to make breakthrough progress in high-level servers and computer platforms.
At present, memory manufacturing factories including Samsung, Micron and SK Hynix have completed DDR6 prototype chip design and have conducted test verification with platform operators such as Intel, AMD, and NVIDIA. Industry expects DDR6 to be certified by JEDEC in 2026 and enter the volume production stage in 2027, becoming the core memory standard for the next generation data center and cloud platform.
DDR6 Memory Development Speeds Up With Motherboard & Module Makers Working On New Designs Include CAMM2, Eying A 2027 Release Window With 8800 MT/s Base, And 17,600 MT/s Max Speeds
