Semiconductor packaging and testing factory ASE Investment Holdings announced today that its consolidated revenue in September was NT$60.561 billion, a monthly increase of 7.3% and an annual increase of 9%, which is a single-month high since Novembe...
Semiconductor packaging and testing factory ASE Investment Holdings announced today that its consolidated revenue in September was NT$60.561 billion, a monthly increase of 7.3% and an annual increase of 9%, which is a single-month high since November 2022. ASE Investment Holdings' consolidated revenue for the third quarter was 168.569 billion yuan, a quarterly increase of 11.8% and an annual increase of 5.3%, the highest since the first quarter of 2023.
ASE Investment Holdings’ consolidated revenue in the first nine months of this year was 467.472 billion yuan, an increase of 7.92% compared with the same period in 2024. ASE Investment Holdings previously estimated that consolidated revenue in the third quarter would have increased by 6% to 8% quarter-to-quarter if priced in New Taiwan dollars, which was better than expected.
From the perspective of packaging, testing and materials (ATM) projects, ASE Investment Holdings' third-quarter packaging and testing materials revenue was NT$100.289 billion, a quarterly increase of 8.3% and an annual increase of 16.9%. Compared with the investment control's previous estimate, the third-quarter ATM revenue in New Taiwan dollars increased by 3% to 5% quarterly, and the results were better than expected.
ASE Investment Holdings previously stated that the growth momentum of packaging and testing business will continue in the third quarter and will continue to grow quarterly in the fourth quarter.
In the advanced packaging and testing segment, investment control estimates that this year’s revenue target will increase by US$1 billion compared with 2024, and contribute to a 10% growth rate in the packaging and testing business. This year’s general business growth rate will be about a mid-to-high single-digit percentage, continuing to benefit from the demand for semiconductor packaging and testing related to artificial intelligence (AI) chip applications.
